Back Grinding Tape Laminator

Manual wafer laminators used to apply protective & back grinding films onto substrates.

Back Grinding Tape Laminator L-200

Manual wafer laminator with a high degree of flexibility and versatility for dynamic environments. Suitable for up to 8″ wafers.

Manual wafer laminator with a high degree of flexibility and versatility for dynamic environments. Suitable for up to 300mm wafers.

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