Wafer Singulation Equipment

All our machines are engineered and produced in Switzerland by POWATEC with minimal footprint for clean room applications

Each device is customizable and we offer free sample testing or video conferences to identify the best fit for our customer’s needs

Semi-Automatic Wafer Mounter

Powatec wafer mounters are used to prepare wafers for dicing by ensuring the tape is applied air-void free to the wafer and corresponding dicing frame. We offer manual and semi-automatic devices for standard & TAIKO wafers, non-contact setups (NCS), and bumped or structured wafers.

WM-650 GaAs for up to Ø6″

UV Curing System | UV Irradiation System

Powatec UV-LED systems are used to cure UV-sensitive tapes/foils so as to reduce their adhesion levels enough to remove the tape, or pick the dies after wafer singulation.

Standard UV Curing System U-200

Standard UV Curing System U-300

Standard UV Curing System U-450

UV Flash Curing System UF-300

Back Grinding Tape Laminator

Powatec wafer laminators are used to apply air-void free protective or back grinding tapes onto wafers.

L-200 for up to Ø8″

L-300 for up to Ø300mm

Wafer Expander | Die-Matrix Expander

Powatec expansion tools are used to uniformly stretch the tape on which a singulated wafer is mounted, thereby increasing the space between dies and facilitating further handling.

ETM-150 for up to Ø6″

ETM-300 for up to Ø300mm

6" and 8" Dicing Frame Cassette/Magazine

Powatec offers a wide range of cassettes/magazines used to ensure the proper storage and handling of mounted wafers according to the size of the frame.

6″ Dicing Frame Magazine, 25 Slots

8″ Dicing Frame Magazine, 25 Slots

12" Dicing Frame Cassette / Magazine

Powatec offers a wide range of cassettes/magazines used to ensure the proper storage and handling of mounted wafers according to the size of the frame.

12″ Dicing Frame Magazine, 13 Slots

12″ Dicing Frame Magazine, 25 Slots

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Semi-Automatic Wafer Mounter

Engineered for high-precision, tension-controlled mounting of silicon wafers, GaAs, and other delicate substrates. Our semi-automatic wafer mounting systems offer ultimate film tension repeatability, bubble-free lamination, and compatibility with various frame sizes, ensuring optimized yields for critical backend semiconductor processing.

UV Curing System | UV Irradiation System

Designed for rapid, uniform UV curing of dicing and backgrinding tapes. Our high-efficiency UV irradiation equipment utilizes advanced lamp technology with optimized wavelengths to ensure clean, controlled adhesive reduction, enabling effortless wafer detaping without residue.

Semi-Automatic Wafer Mounter

High-precision tape mounting solutions engineered for delicate semiconductor substrates. Ensures bubble-free wafer lamination with uniform pressure and precise tension controls for optimal processing yields.

UV Curing System | UV Irradiation System

Efficient and reliable ultraviolet systems optimized for uniform curing of dicing and backgrinding tapes. Facilitates clean, complete release of semiconductor wafers with fast cycle times and standard-setting safety.